3.7. . V1, to be:
1. the discovery is leading to; 2. the discovery is able to lead to; 3. the discovery is certain to lead to; 4. the discovery is expected to lead to; 5. the discovery is likely to lead to; 6. the discovery is supposed to lead to; 7. the discovery is to lead to; 8. the discovery is led with; 9. the discovery is of value; 10. the discovery is due to; 11. the discovery is critical; 12. the discovery is particularly important in; 13. the discovery is sure to lead to; 14. the discovery is presently in wide-spread use; 15. the discovery is a readily apparent means; 16. the discovery is being applied to; 17. the objective is to discover
3.8. . V1, to have:
1. the improvement has a reason; 2. the improvement has influenced; 3. the improvement has been influenced; 4. the improvement has been supposed to influence; 5. the improvement has to be introduced; 6. we have studied the emission properties of gas plasma; 7. we have to study the properties of; 8. the properties have been studied
3.9. . , :
N1? N1?
1. the improvement requires the improvement is required
2. the concept predicts the concept is predicted
3. the effort makes the effort is made
4. the density determines the density is determined
3.10. , V1:
1. the solution is provided (was provided, has been provided, has to be provided, will be provided); 2. the unit was arranged (has been arranged, is being arranged, is to be arranged)
3.11. , to follow, to influence, to watch :
1. the pattern is influenced (was influenced, has been influenced, has to be influenced, is to be influenced); 2. the experiment was followed (has been followed) by, 3. the packing is watched (is being watched, has been watched, will be watched)
3.12. , :
1. We are still learning how to exploit the potential of the integrated circuits. 2. Small and reliable sensing and control devices are the essential elements in complex systems. 3. The attempts to miniaturize electronic components are largely successful. 4. Testing is needed in the course of production. 5. The most striking characteristic of the microelectronics industry has been a rapid decline in cost. 6. Electronics has extended man's intellectual power. 7. Several kinds of microelectronic transistors have been developed, and for each of them families of associated circuit elements and circuit patterns have evolved. 8. The fundamental units of electronic logic are circuits called gates.
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3.1. . , : self-aligning chemically selective manner; masks; process complexity; selective low pressure chemical vapour deposition (LPCVD). . .
Tungsten is of particular interest in IC technology because it can be deposited in a self-aligning () chemically selective manner on silicon, metals, or silitides. Its volume filling capability serves to enhance planarity, a high priority in multilevel chip designs, and because it can be deposited without additional masks, process complexity is reduced with savings in cost.
Selective low pressure chemical vapour deposition (LPCVD) of tungsten can provide diffusion and etch barriers, via fills, low resistance source/drain and gate shunts, masks for X-ray lithography and many others.
The last years have been a time of rapid progress in LPCVD tungsten technology.
.2. . . .
Rapid Thermal Processing
RTP is one of the exciting new wafer fabrication technologies. Its origin can be traced to the laser annealing () research of the early 1980's, but it is only with the very recent appearance of techniques and equipment suitable for use in production that the technique has begun to attract serious attention of process engineers.
Current applications for RTP include ion implant annealing, glass reflow, silicide formation, and deposition of thin gate oxides.
The RTP equipment market is expected to have one of the highest growth factors in the equipment industry, a compound annual growth rate of 36.6% over the years 1987 to 1991.
3.3. .
Laving Down Thin Film
Most often, thin-film deposition on a ceramic substrate is done in a vacuum chamber by evaporating or sputtering conductive, resistive, or dielectric material on a carefully cleaned substrate.
The vacuum prevents oxidation and allows the molecules of material being deposited to travel to the target with minimum collisions with gas molecules.
.4. . .
Evaporation and Sputtering
In the case of evaporation, the material to be deposited is heated by a resistive heating unit until the molecules acquire the thermal energy necessary to leave the surface at a suitable speed to ensure deposition.
Sputtering differs from evaporation in that an electrical field accelerates the positive gas ions toward a cathode that is covered with a material to be deposited. An ion striking the cathode causes a molecule to be ejected and deposited on the substrate.
